IC Packaging Mechanical Engineer
📋 Role Overview & Responsibilities
IC Packaging Mechanical Design Engineer - (New Providence, NJ)Join a growing engineering team and develop cutting-edge optical modules for high-performance computing.
Responsibilities:Design innovative packaging solutions for optical modulesDevelop testing procedures and ensure product reliabilityTroubleshoot technical challenges in packaging and materialsBuild and maintain component models and technical drawingsCollaborate with internal and external teams for seamless integration
Qualifications:BS in Mechanical Engineering2+ years of IC package design experience Or Ph.D. in Mechanical Engineering Excellent communication skills
Preferred Skills:SolidWorks (PDM) & FEA tools (ANSYS Mechanical)Rapid prototyping (Formlabs 3D printing a plus)Design for manufacturing (CNC, casting, MIM)Optical module reliability (Telcordia GR-468)Advanced IC packaging technologies (3D/2.5D IC, FOWLP, MCM FC-BGA)High-speed test socket and connector experience
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This position is located in New Providence, NJ with potential relocation and sponsorship assistance depending on candidate qualifications.
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