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Circuit Designer: III-V Electronics

πŸ“ Kissimmee, FL πŸ•’
Work Model
πŸ“ Kissimmee, FL
Employment
πŸ’Ό Full-Time Direct
Recruitment Type
πŸ›‘οΈ Direct to HR Pipeline
πŸ›‘οΈ
Human-Verified Opening: Inspected by Sarah Jenkins, CIPD • RemoteVault Editorial Team. Authenticated directly from 's hiring pipeline • Zero recruiter markups or candidate fees. Verification Standards →

πŸ“‹ Role Overview & Responsibilities

EM Expert: MM-Wave Packaging

What will you do

Next generation communication and radar systems will operate at frequencies beyond 100 GHz. At such high frequencies, traditional interconnect solutions based on PCBs incur excessively high loss and leakage of signal. Furthermore, larger antenna arrays are needed to overcome higher path loss, low amplification, and low absolute power from transistors. Heterogeneous integration of different transistor technologies and passive components is essential to meet link budget and high data rate requirements at these frequencies.

Imec USA is looking for an EM simulation expert with modelling experience in mm-wave transitions, antennas, wafer level components (MIMCAP, TSV, Micro-bumps). Knowledge of both technology and design aspects of mm-wave passive structures and their co-design with RF circuits will be your main responsibility. You will be integrated into imec’s Advanced RF cross-site team across Kissimmee, Florida and Leuven, Belgium and work together with other experts from hetero-integration, circuit design and technology development teams. Literature survey and keeping an up-to-date list of recent (academic and industry) developments in this field will be an additional task.

Your tasks will include

Simulations of RF passive components – mm-wave transitions, antennas, MIMCAPS, resistors, TSV, Micro-bumpsand Benchmarking with advanced PCB technologies like IC Substrate, Substrate like PCBs and Scaled organic packagesTechnology Co-optimization - Work with 3D technology experts to define technology flows where both manufacturability and EM performance are co-optimizedwill be based in Kissimmee, Florida but open to travel to Leuven, Belgium for technical discussions, training and brainstorming

About you:Background in EM field simulations, mm-wave packagingKnowledge of packaging technologies like Infineon EWLB, Amkor Swift, TSMC FOWLP, IC Substrates / mSAP, Silicon interposer, Glass interposer etc.Proficient in EM simulations tool like Ansys HFSS or CST Microwave StudioPHd or a Master’s degree with 3+ years of relevant job experienceExperience with circuit simulation in Keysight ADS will be an additional advantageEnglish language skills (written and spoken)

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This position is located in Kissimmee, FL with potential relocation and sponsorship assistance depending on candidate qualifications.

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